Chip Test

Test Engineering

• Project Feasibility Study
  • Data Sheet & Product Functionality Review and Analysis
  • Determination of Required Tests based on Product application and Electrical parameter specifications
  • Tabulation of Test methodology for each test with input / output conditions&  limits, in the form of a Test Plan Matrix
  • Agreement with Customer on the derived Test Plan Matrix & Scope
    finalization

• Hardware Design & Fabrication
  • Selection of appropriate Tester platform capable of handling the product for  the agreed Test Plan Matrix
  • Design of the product hardware load board schematic and the Adaptor  Board for interfacing with the DUT
  • Selection of Manual Test Socket, Handler Contactor Mechanism inclusive of  the Mechanical interface design
  • Design of the probe card based on the die pad layout and suitable interface  with the Tester Load Board
  • Fabrication of designed hardware modules like Load Board, Manual DUT Board,  Handler Interface Board & the Probe Cards

• Program Development & Debugging

• Development of the test program code for the designed hardware schematic as per the agreed Test Plan Matrix conditions
• Debugging of the program using the constructed hardware modules and  known good products
• Verification of test measurement data for each parameter
• Refinement of hardware or test program depending upon the product  characteristics & the observed values, for better performance
• Test Time Optimization is considered as part of the program debugging

• Product Characterization & Correlation
  • Verification & Refinement of the developed application program and set-up  using Correlation Units provided by the Customer, wherever available
  • Correlation of Tester measurements with Bench parameter values in case of
    non-availability of known correlation units
  • Electrical Characterization of New products for various parameters & input  conditions
  • Statistical Analysis of the measured values & Determination of test limits
  • Generation of Schmoo & Statistical distribution plots wherever possible for  review by the Design team

Hardware

• Electronic Products

• • Boards for High Speed Digital and Precision Analog Requirements
  • Boards for Multi-site and Equal Trace Length Requirements
  • ATE Board Diagnostics and Troubleshooting
  • ATE & Application Board Hardware Schematics
  • Board Layout Design & Engineering
  • Board Fabrication & Testing
  • BOM Components Procurement & Assembly
  • Customized Ring Type & Rail type Interconnectors

• PCB Development
  • Schematics Design – Cadence, Mentor Graphics & Orcad Tools
  • Board Layout Design – Allegro, Orcad & Mentor Graphics Tools
  • 28 Layers Impedance Controlled Boards Design
  • Board Thickness upto 6 mm and Airgap as low as 0.3 mils
  • Normal & Sequential Lamination with Technologies
  • Capability for both Blind & Buried Via Options
  • Hard Gold & Immersion Gold Plating Options

• Mechanical Products

• • Gravity Feed Plunge to Board Low foot print Handlers
  • Low Cost Manipulators for different ATE Test Heads
  • Handler Spare Parts & Consumables
  • Gravity / Bowl Feed & Map Handler Conversion Kits
  • Pick & Place Handler Conversion kits
  • Tape & Reel Conversion Kits for various Packages
  • ATE Test Sockets & Contactors upto 5 mil pitch
  • Mechanical Stiffeners for ETS, 93K & Advantest Load Boards
  • Docking plates for Pick & Place & Gravity Feed Handlers

• Mechanical Development
  • Cutting edge Mechanical Engineering Services
  • Conceptual & Product Design
  • 2D CAD Drafting & Drawings
  • 3D Modelling
  • FEA Analysis & CAE Simulations

Automation Solutions

Solution

• • Embedded Hardware Design for Semiconductor Equipment
  • Embedded Software development for Equipment Control / Interface
  • Semiconductor Equipment and Process Control Applications
  • Bench Instrumentation and Labview Automation
  • Automated Data Collection and Report Generation
  • Sample Solutions – PASCAL LASER, Wireless commander, GPS tracker
  • TCP/IP based Emergency Alarm System
  • Poke yoke systems to avoid manual errors
  • PLC based system Automation Solutions
  • PLC based system Automation to PC based system
  • Access control and Security systems
  • Visual inspecting systems for visual verifications
  • Embedded Peel force Analyzer with graphical output
  • Auto loading / unloading mechanism for Manual Equipment
  • Embedded temperature and Humidity monitoring system

• Technologies
  • Microcontroller Architecture & their Development Tools
  • PC Based Tools & Embedded Software Stacks Development & Management
  • 8-bit, 16-bit & 32-bit microcontrollers, including 8051, PIC, ARM
  • Assembler, C, VB, VC++
  • Wide range of Embedded compilers – Keil, GNU and CodeWarrior , CCS C
  • Embedded real-time operating systems, Windows 2000/XP/Vista/7 and Linux
  • Communication protocols – I2C , SPI, RS232, RS485 , USB , GSM , GPS, TCP/IP, ZIGBEE

Test Production

• General

• • Capabilities to test products in both packaged level Component form as well as die level wafer form
  • Assignment of Unique Traceable Production Lot Numbers and Tracking of  individual Lot test data
  • On-line Monitoring of Test Yields and Analysis / Reporting of Low Yielding  Engineering Lots
  • Even load balancing technique is adopted to handle any sudden spike in the  production volumes, than the usuals
  • Fool-proof reject handling mechanism at all stages of Testing
  • Controlled Test Program Release & Revision Control
  • Controlled Load Boards & associated Hardware Maintenance
  • Documented well established set-up verification procedures

• Component Test
  • Single-site & Multi-site handling capabilities
  • Kelvin and True Plunge to Board Contacts available
  • Soft and Hard Docking Handler Mechanisms
  • Inhouse design & fabrication of Handler Contactor Interface
  • On-line inspection of Visual Mechanical Parameters
• Wafer Test

• • Single-site & Multi-Site handling capabilities
  • Offline and Online Inking capabilities
  • Wafer Sort Results available in Standard Map formats
  • On-line inspection of Probe & Ink Mark